Probe stylus

ABSTRACT

The present invention relates to a probe stylus  1  for an inspection of semiconductor device in a state of wafer. When a large number of pad  5  are disposed in a semiconductor device, setting of the probe styluses  1  onto a probe card, on which a semiconductor to be inspected shall be mounted, is difficult. An object of the present invention is to improve the form of the probe stylus to solve this problem. The object is attained by a probe stylus according to the present invention. The probe stylus  1  has a first electrically conductive member  2 , a second electrically conductive member  3 , and an insulating member  4  disposed between the first and second electrically conductive members  2,3 . The first and second electrically conductive members  2,3  have a form of a needle and they form a single needle. In an embodiment, the first and second electrically conductive members have a half round cross section. In another embodiment, each of the first and second electrically conductive members has a resilient portion at their tip portion. In another embodiment, the first electrically conductive member is covered with the insulating member, and the insulating member is covered with the second electrically conductive member. In further another embodiment, a slit is disposed between the first and second electrically conductive members.

This application is a division of U.S. application Ser. No. 09/330,155filed Jun. 11, 1999 now U.S. Pat. No. 6,404,213.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a probe stylus for inspecting asemiconductor at a wafer state.

2. Description of the Prior Art

A probe stylus in the prior art is constituted by a single electricallyconductive needle. In a high precision inspection of a semiconductordevice at a wafer state, a probe styluses for applying force and probestyluses for sensing are connected to pads disposed in a semiconductor.These probe styluses are connected to form a Kelvin connection. In suchprobe styluses, a cantilever type probe stylus and a perpendicular typeprobe stylus are known. The cantilever type probe stylus contactsobliquely With a pad disposed in a semiconductor device, and theperpendicular type probe stylus contacts perpendicularly with a pad, atan inspection of a semiconductor.

During an inspection of an I/O of a semiconductor device, for example, ahigh speed logic element, when an output data of a driver of a tester isinputted into a signal input terminal of a semiconductor, and the outputfrom the output terminal of the semiconductor is received by acomparator of the tester, there is case that a dead band appears. Foreliminating such a dead band, it is proposed to use a signal linespecialized for transferring the data signal from the output terminal ofthe tester to the input terminal of the semiconductor and another signalline specialized for transferring the signal from the output terminal ofthe semiconductor to the comparator of the tester. A dead band means aperiod in which the tester cannot judge the semiconductor because of aconflict of the signals from the output terminal of the semiconductorand the data signal from the output terminal of the driver of thetester.

Many probe styluses are already known, which allows precise inspectionof a semiconductor device at a wafer state, even when a large number ofpads are disposed in the semiconductor device. Such probe styluses aredisclosed, for example, in Japanese Patent Applications JP-A-5-144895,JP-Utility-Model-A-1-174932, JP-A-Utility-Model-61-104380, JP-A-2-124469and JP-A-4-288847.

FIG. 62 is a perspective view of a probe stylus disclosed inJP-A-5144895. FIG. 62 shows a state that a probe stylus 201 contacts apad 204 disposed in a semiconductor. The probe stylus 201 is a so-calledcantilever type probe stylus constituted by a first electricallyconductive member 202 and a second electrically conductive member 203,which are joined to each other so as to form a branching structure.

FIG. 63 is a cross sectional view of a probe stylus disclosed inJP-Utility-Model-A-1-174932. FIG. 63 shows that a probe stylus 211contacts with a pad 216 disposed in a semiconductor. The probe stylus211 is a so-called perpendicular type probe stylus constituted by afirst electrically conductive member 212, a second electricallyconductive member 203 and an insulating member 214 disposed between thefirst and second probe stylus. The first and second electricallyconductive members 212, 213, have a form of a conventional perpendiculartype probe stylus. The first and second electrically conductive members212, 213 and the insulating member 214 are adhered to each other by anadhesive 215.

FIG. 64 is a cross sectional view of a probe stylus disclosed inJP-Utility-Model-A-61-104380. FIG. 64 shows that a probe stylus 221contacts a pad disposed in a semiconductor. The probe stylus 221 is aso-called cantilever type probe stylus constituted of a firstelectrically conductive member 222, a second electrically conductivemember 223, and insulating member 224 disposed between and around thefirst and second electrically conductive members 222, 223. The firstelectrically conductive member 222 has a form of a conventionalcantilever type probe stylus. The second electrically conductive member223 is thinner than the first electrically conductive member 222. Thefirst and second electrically conductive members 222, 223 are fixed toeach other by the insulating member 224 so that they form a single body.

FIG. 65(a) is a side view of a probe stylus disclosed in JP-A-2-124469,FIG. 65(b) is a E1—E1 cross sectional view of FIG. 65(a). The probestylus 231 is a so-called cantilever type probe stylus constituted of afirst electrically conductive member for providing force 232, a secondelectrically conductive member for sensing 233, and an insulating member234 disposed between the first and second electrically conductivemembers 232, 233. The first electrically conductive member for producingforce 232 has a form of a conventional cantilever type probe stylus. Theoutside of the first electrically conductive member 232 is covered withthe insulating member 234, and the outside of the insulating member 234,in turn, is covered with the second electrically conductive members 233.

Also, JP-A-4-288847 discloses a similar probe stylus constituted of afirst electrically conductive member for providing force 232, which hasa form of a conventional cantilever type probe stylus and is coveredwith an insulating member 234, and a second electrically conductivemember for sensing 233, which covers the outside of the insulatingmember 234.

The probe stylus of the prior art, constituted as a single electricallyconductive needle, has following drawbacks. In general, a large numberof probe styluses are required for high precision inspection of asemiconductor in a wafer state when a large number of pads is disposedin the semiconductor device. However, the setting of the probe stylusesof the prior art onto a probe card is difficult when a large number ofpads are disposed in a semiconductor device.

Another drawback is that a probe card tends to warp, when perpendiculartype probe styluses contact with the pads disposed in a semiconductordevice.

SUMMARY OF THE INVENTION

An object of the present invention is to eliminate these drawbacks ofthe probe stylus of the prior art.

Another object is to propose a probe stylus, which allows preciseinspection of a semiconductor at a wafer state, even when a large numberof the pads are disposed in a semiconductor device.

Another object is to propose a probe stylus which does not cause a warpof the probe card when the probe styluses contact the pads, even when alarge number of pads are disposed in a semiconductor device.

The object is attained by a probe stylus according to claim 1.

In an embodiment the probe stylus of the present invention, the crosssection of each of the first and second electrically conductive membersperpendicular to their longitudinal direction is a half round.

In another embodiment the probe stylus of the present invention, each ofthe first and second electrically conductive members has a resilientportion at their tip portion, where the probe stylus contacts with a paddisposed in a semiconductor device.

In another embodiment the probe stylus of the present invention, thefirst electrically conductive member is covered with the insulatingmember, and the insulating member is covered with the secondelectrically conductive member, and the first and second electricallyconductive members are electrically connected to each other at their tipportion.

In another embodiment the probe stylus of the present invention, thefirst electrically conductive member is covered with the insulatingmember, and the insulating member is covered with the secondelectrically insulating member, and the first and second electricallyconductive members are not electrically connected to each other at theirtip portion, but are connected to each other through a pad disposed in asemiconductor device at an inspection of the semiconductor device.

In another embodiment the probe stylus of the present invention, thefirst electrically conductive member is covered with the insulatingmember, and the insulating member is covered with the secondelectrically conductive member, and the first and second electricallyconductive members are not electrically connected to each other at theirtip portion, but are connected to each other through a pad disposed in asemiconductor device at an inspection of the semiconductor device.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic side view of a probe stylus as a first embodimentof the present invention.

FIG. 2 is a plan view of the probe stylus seen from the side A in FIG.1.

FIG. 3 is a cross sectional view of the probe stylus along B—B line inFIG. 1.

FIG. 4 is a cross sectional view of a probe card having probe stylusesaccording to the first embodiment of the present invention.

FIG. 5 is a detailed cross sectional view of the a connecting portion ofa probe stylus and the probe card of FIG. 4.

FIG. 6 is a plan view of the connecting portion of a probe stylus andthe probe card seen from the side D in FIG. 5.

FIG. 7 is a schematic side view of a probe stylus as a second embodimentof,the present invention.

FIG. 8 is a cross sectional view of the probe stylus along E—E line inFIG. 7.

FIG. 9 is a plan view of a probe stylus as a third embodiment of thepresent invention.

FIG. 10 is a side view of the probe stylus seen from the side F in FIG.9.

FIG. 11 is a cross sectional view of the probe stylus along G—G line inFIG. 11.

FIG. 12 is a plan view of the connecting portion of a probe stylusaccording to the third embodiment and a probe card seen from the bottomside.

FIG. 13 is a plan view of a probe stylus according to the fourthembodiment.

FIG. 14 is a cross sectional view of the probe stylus along H—H line inFIG. 13.

FIG. 15 is a schematic side view of a probe stylus as embodiment of thepresent invention.

FIG. 16 is a cross sectional view of the probe stylus along I—I line inFIG. 15.

FIG. 17 is a cross sectional views of a probe card having probe stylusesaccording to the fifth embodiment of the present invention.

FIG. 18 is a detailed cross sectional view of the probe card at theconnecting portion of a probe card and a probe stylus according to thefifth embodiment, showing an example of the connection between them.

FIG. 19 a detailed cross sectional view of the probe card at theconnecting portion of a probe card and a probe stylus according to thefifth embodiment, showing another example of the connection betweenthem.

FIG. 20 is a schematic side view of a probe stylus as a sixth embodimentof the present invention.

FIG. 21 is a cross sectional view of the probe stylus along K—K line inFIG. 20.

FIG. 22 is a schematic side view of a probe stylus as a seventhembodiment of present invention.

FIG. 23 is a cross sectional view of the probe stylus along L—L line inFIG. 22.

FIG. 24 is a schematic side view of a probe stylus as an eighthembodiment of the present invention.

FIG. 25 is a cross sectional view of the probe stylus along M—M line inFIG. 24.

FIG. 26 is a schematic side view of a probe stylus as a ninth embodimentof present invention.

FIG. 27 is a cross sectional view of the probe stylus along N—N line inFIG. 26.

FIG. 28 is a schematic side view of a probe stylus as a tenth embodimentof the present invention.

FIG. 29 is a cross sectional view of the probe stylus along O—O line inFIG. 28.

FIG. 30 is a schematic side view of a probe stylus as an eleventhembodiment of the present invention.

FIG. 31 is a cross sectional view of the probe stylus along P—P line inFIG. 30.

FIG. 32 is a schematic side view of a probe stylus as a twelfthembodiment of the present invention.

FIG. 33 is a cross sectional view of the probe stylus along Q—Q line inFIG. 32.

FIG. 34 is a schematic side view of a probe stylus as a thirteenthembodiment of the present invention.

FIG. 35 is a cross sectional view of the probe stylus along R—R line inFIG. 34.

FIG. 36 is a schematic side view of a probe stylus as a fourteenthembodiment of e present invention.

FIG. 37 is a cross sectional view of the probe stylus along S—S line inFIG. 36.

FIG. 38 is a schematic side view of a probe stylus as a fifteenthembodiment of the present invention.

FIG. 39 is a cross sectional view of the probe stylus along T—T line inFIG. 38.

FIG. 40 is a schematic side view of a probe stylus as a sixteenthembodiment of the present invention.

FIG. 41 is a cross sectional view of the probe stylus along U—U line inFIG. 40.

FIG. 42 is a schematic side view of a probe stylus as a seventeenthembodiment of the present invention.

FIG. 43 is a cross sectional view of the probe stylus along V—V line inFIG. 42.

FIG. 44 is a cross sectional views of a connecting portion between aprobe card a probe stylus according to the seventeenth embodiment of thepresent invention.

FIG. 45 is a schematic side view of a probe stylus as a eighteenthembodiment of the present invention.

FIG. 46 is a cross sectional view of the probe stylus along W—W line inFIG. 45.

FIG. 47 is a schematic side view of a probe stylus as a nineteenthembodiment o the present invention.

FIG. 48 is a cross sectional view of the probe stylus along X—X line inFIG. 47.

FIG. 49 is a detailed cross sectional view of an example of theconnecting portion between the probe card and a substrate of a probestylus according to the nineteenth embodiment.

FIG. 50 is a detailed cross sectional view of another example of theconnecting portion between the probe card and a substrate of a probestylus according to the nineteenth embodiment.

FIG. 51 is a schematic side view of a probe stylus as a twentiethembodiment of the present invention.

FIG. 52 is a cross sectional view of the probe stylus along Y—Y line inFIG. 51.

FIG. 53 is a schematic side view of a probe stylus as a twenty-firstembodiment of e present invention.

FIG. 54 is a cross sectional view of the probe stylus along Z—Z line inFIG. 53.

FIG. 55 is a schematic side view of a probe stylus as a twenty-secondembodiment of the present invention.

FIG. 56 is a cross sectional view of the probe stylus along A1—A1 linein FIG. 55.

FIG. 57 is a schematic plan view of a probe stylus according to thetwenty-third embodiment at a state that the probe stylus is notcontacting with a pad disposed in a semiconductor.

FIG. 58 is a schematic plan view of a probe stylus according to thetwenty-third embodiment at a state that the probe stylus is contactingwith a pad disposed in a semiconductor.

FIG. 59 is a side view of a probe stylus seen from the side B1 in FIG.57.

FIG. 60 is a cross sectional view of an example of a probe stylus, (a)shows a cross section along the line C1—C1 in FIG. 57, (b) shows a crosssection along the line D1—D1 in FIG. 57.

FIG. 61 is a cross sectional view of another example of a probe stylus,which has a form different from that of FIG. 60, (a) shows a crosssection along the line C1—C1 in FIG. 57, (b) shows a cross section alongthe line D1—D1 in FIG. 57.

FIG. 62 is a perspective view of a probe stylus disclosed inJP-A-5-144895.

FIG. 63 is a cross sectional view of a probe stylus disclosed inJP-Utility-Model-A-5-144895.

FIG. 64 is a cross sectional view of a probe stylus disclosed inJP-Utility-Model-A-61-104380.

FIG. 65(a) is a side view of a probe stylus disclosed in JP-A-61-104380,FIG. 65(b) is a E1—E1 cross sectional view of FIG. 65(a).

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

FIRST EMBODIMENT

The first embodiment of the probe stylus according to the presentinvention is explained below, referring to FIG. 1—6. FIGS. 1 and 2 showthe probe stylus 1 contacting a pad 5 disposed in a semiconductordevice.

The probe stylus 1 of the first embodiment of the present invention is aso-called cantilever type probe stylus. Each of the first and secondelectrically conductive members 2,3 has a form of a needle. The crosssection perpendicular to the longitudinal direction of the needle ishalf round. Namely, each of the first and second electrically conductivemember has a form of a conventional cantilever type probe stylus butdivided equally along its longitudinal axis. Thus, the assembly of theprobe stylus of the first embodiment has a thickness substantially equalto the conventional probe stylus. The first and second electricallyconductive members 2, 3 are electrically connected to each other attheir tip, where the probe stylus 1 contacts a pad 5 disposed in asemiconductor device, and are physically connected by an insulator 4elsewhere so that the first and second electrically conductive members2, 3 and the insulating member 4 form a single needle. In thisembodiment, the first and second electrically conductive members 2, 3are arranged so that one of them is positioned over the other.

Referring to FIG. 4, a base substrate 12 of the probe card 11 has acenter hole 13, and a probe stylus 1 is fixed to a ring 14 by asynthetic resin 15. FIG. 5 shows a detailed cross sectional view of thepart C in FIG. 4 framed by a broken line. FIG. 6 is a plan view of theconnecting portion of a probe stylus and the probe card seen from theside D in FIG. 5. Referring to FIG. 6, first and second lands 16, 17 aredisposed on the base substrate 12 of the probe card 1. The firstelectrically conductive member 2 contacts a first land 16, the secondelectrically conductive member 3 contacts a second land 17. Referencenumeral 18 denotes soldering portion connecting the first and secondelectrically conductive members 2, 3 with the first and second land 16,17, respectively. The structure of the other parts are similar to thatshown in FIGS. 1, 4.

The function of the probe card and the probe stylus is explained below.

At a precise inspection of a semiconductor device at a wafer state, aprobe stylus 1 is brought in contact with a pad 5 disposed in asemiconductor device. One of the first and second electricallyconductive member 2, 3 is used as an electrically conductive member forproviding force, and the other is used as an electrically conductingmember for sensing. In this case, the first and second electricallyconductive members are connected at their tip; therefore, the value ofvoltage and/or electric current can be compensated up to the tip of theprobe stylus 1, when a Kelvin connection is formed at the tips of thefirst and second electrically conductive member 2, 3.

At an inspection of an I/O of a semiconductor device at a wafer state,the probe stylus 1 is brought in contact with a pad 5 disposed in thesemiconductor device, and one of the first and second electricallyconductive members 2, 3 is used as an electrically conductive member fordriving and the other is used as an electrically conductive member fortester. In this case, the first and second electrically conductivemembers are electrically connected to each other at their tip.Therefore, the line specialized for transferring output data signal fromthe driver to the pad 5 disposed in the semiconductor device, and theline specialized for transferring the output data signal from the pad 5to the comparator of the tester are assured up to the tip of the probestylus.

As explained, the probe stylus 1 according to the first embodiment ofthe present invention has a first electrically conductive member 2 and asecond electrically conductive member 3. Therefore, such a probe stylusfunctions as an equivalent to two probe styluses of the prior art. As aresult, by contacting one probe stylus to one of the pads disposed in asemiconductor device, it is possible to eliminate so-called dead band inthe comparator in a precise inspection of a semiconductor device at awafer state, or in an inspection of an I/O of a semiconductor device ata wafer state. Also in a case that a large number of pads are disposedin a semiconductor device, corresponding large number of probe stylusescan be disposed on a probe card, so that so-called dead band in thecomparator can be eliminated in such a precise inspection of asemiconductor device at a wafer state, or in an inspection of an I/O ofa semiconductor device at a wafer state.

A probe stylus according to the first embodiment of the presentinvention functions equivalently to two probe styluses of the prior art.Hence, the number of probe styluses 1 to be attached to a probe cardand/or the area required for the arrangement of the probe stylus in aprobe card can be reduced. As a result, the fabrication cost can bereduced.

Additionally, according to the first embodiment of the presentinvention, each of the first and second electrically conductive membershas a half round cross section perpendicular to the longitudinaldirection. Therefore, the thickness of the probe stylus according to thefirst embodiment is smaller than that of bundled two probe styluses ofthe prior art. As a result, also in a case that a large number of padsare disposed in a semiconductor device, a corresponding number of theprobe styluses 1 can be attached onto a probe card.

SECOND EMBODIMENT

In a probe stylus according to the first embodiment, the first andsecond electrically conductive members 2, 3 are connected at their tip.On the other hand, in a probe stylus according to the second embodimentof the present invention, the first and second electrically conductivemembers are not connected at their tip. During an inspection of asemiconductor device, they are connected to each other through a paddisposed in a semiconductor device. The other features are similar tothat of the first embodiment.

FIGS. 7 shows that the probe stylus 1 a in contact with a pad 5 disposedin a semiconductor device. Referring to the figure, reference numerals 1a, 2 a, 3 a denote a probe stylus, a first electrically conductivemember, and a second electrically conductive member, respectively. Thefirst and second electrically conductive members 2 a, 3 a are connectedby an insulating member 4 a arranged between them. Reference numeral 5denotes a pad disposed in a semiconductor.

The structure of a probe card having probe stylus 1 a according to thesecond embodiment is similar to that of the probe card shown in FIG. 4.The connection between a probe stylus 1 a and the substrate of a probecard is similar to that shown in FIGS. 5, 6.

The function of the probe card and the probe stylus is explained below.

At a precise inspection of a semiconductor device at a wafer state, aprobe stylus 1 a is brought in contact with a pad 5 disposed in thesemiconductor device. And one of the first and second electricallyconductive member 2 a, 3 a is used as an electrically conductive memberfor forcing, and the other is used as an electrically conducting memberfor sensing. In this case, the first and second electrically conductivemembers connects electrically through the pad 5, therefore, the value ofvoltage and/or electric current can be compensated up to the pad 5, whena Kelvin connection are formed on the pad 5.

At an inspection of an I/O of a semiconductor device at a wafer state,the probe stylus 1 a is brought in contact with a pad 5 disposed in thesemiconductor device, and one of the first and second electricallyconductive member 2 a, 3 a is used as an electrically conductive memberfor driving and the other is used as an electrically conductive memberfor tester. In this case, the first and second electrically conductivemember 2 a, 3 a contact electrically to each other through the pad 5.Therefore, a line specialized for transferring output data signal fromthe driver to the pad 5 disposed in the semiconductor device(hereinafter referred to “a line for driver”), and a line specializedfor transferring the output data signal from the pad 5 to the comparatorof the tester (hereinafter referred to “a line for comparator) areassured up to the pad 5.

As explained, the first and second electrically conductive members 2 a,3 a in the probe stylus according to the second embodiment contactelectrically to each other through a pad 5 disposed in the semiconductorat an inspection of a semiconductor device. Therefore, the value ofvoltage and/or electric current can be compensated up to the pad 5, at aprecise inspection of a semiconductor device at a wafer state. And aline for driver and a line for comparator are assured up to the pad 5,at an inspection of an I/O of a semiconductor device at a wafer state.As a result, a higher precision inspection of a semiconductor device ispossible.

A probe stylus according to the second embodiment has similar advantagesto that of a probe stylus according to the first embodiment.

THIRD EMBODIMENT

The first and second electrically conductive members 2,3 in a probestylus according to the first embodiment are so arranged that one ofthem is positioned over the other. On the other hand, the first andsecond electrically conductive members in a probe stylus according tothe third embodiment are arranged side by side. The other features of aprobe stylus according to the third embodiment are similar to that ofthe first embodiment.

FIGS. 9 and 10 show that a probe stylus 1 b contacts with a pad 5disposed in a semiconductor device. Referring to the figures, referencenumerals 1 b, 2 b, 3 b denote a probe stylus, a first electricallyconductive member, and a second electrically conductive member,respectively. The first and second electrically conductive members 2 b,3 b are connected by an insulating member 4 b arranged between them.Reference numeral 5 denotes a pad disposed in a semiconductor.

The structure of a probe card having probe stylus 1 b according to thethird embodiment is similar to that of the probe card shown in FIG. 4.FIG. 12 corresponds to FIG. 6. An element in FIG. 12 corresponding to anelement in FIGS. 6, 9 are referred by the same reference numeral. Thefunction of each element of a probe stylus according to the thirdembodiment is similar to that of a probe stylus according to the firstembodiment.

Because the first and second electrically conductive members 2 b, 3 b ofthe probe stylus according to the third embodiment are arranged side byside, a force urges them equally, when the probe stylus 1 b contactswith a pad 5 disposed in a semiconductor. As a result, the structuralreliability of the probe stylus is improved.

A probe stylus according to the third embodiment has similar advantagesto that of a probe stylus according to the first embodiment.

FOURTH EMBODIMENT

In a probe stylus according to the third embodiment, the first andsecond electrically conductive members 2 b, 3 b are connected at theirtip. On the other hand, in a probe stylus according to the fourthembodiment of the present invention, the first and second electricallyconductive members are not connected at their tip. And at an inspectionof a semiconductor device, they are connected to each other through apad disposed in the semiconductor device. The other feature is similarto that of the third embodiment.

FIG. 13 shows that the probe stylus 1 c is contacting with a pad 5disposed in a semiconductor device. Referring to the figures, referencenumerals 1 c, 2 c, 3 c denote a probe stylus, a first electricallyconductive member, and a second electrically conductive member,respectively. The first and second electrically conductive members 2 c,3 c are connected by an insulating member 4 c arranged between them.Reference numeral 5 denotes a pad disposed in a semiconductor.

The structure of a probe card having probe stylus 1 c according to thefourth embodiment is similar to that of the probe card shown in FIG. 4.The connection between a probe stylus 1 c and the substrate of a probecard is similar to that shown in FIG. 12. The function of the probestylus according to the fourth embodiment is similar to that of secondembodiment.

As explained, the first and second electrically conductive members 2 c,3 c in the probe stylus according to the fourth embodiment contactelectrically to each other through a pad 5 disposed in the semiconductorat an inspection of a semiconductor device. Therefore, the value ofvoltage and/or electric current can be compensated up to the pad 5, at aprecise inspection of a semiconductor device at a wafer state. And aline for driver and a line for comparator are assured up to the pad 5,at an inspection of an I/O of a semiconductor device at a wafer state.As a result, a higher precision inspection of a semiconductor devicebecomes possible.

A probe stylus according to the fourth embodiment has similar advantagesto that of a probe stylus according to the third embodiment.

FIFTH EMBODIMENT

FIG. 15 shows that the probe stylus 21 is contacting with a pad 5disposed in a semiconductor device. Referring to the figure, referencenumerals 21, 22, 23 denote a probe stylus, a first electricallyconductive member, and a second electrically conductive member,respectively. The first and second electrically conductive members 22,23 are connected by an insulating member 24 arranged between them.Reference numeral 5 denotes a pad disposed in a semiconductor device.

The probe stylus 21 of the fifth embodiment of the present invention isa so-called perpendicular type probe stylus. Each of the first andsecond electrically conductive members 22, 23 has a form of needle. Thecross section perpendicular to the longitudinal direction of the needleis half round. Namely, each of the first and second electricallyconductive member 22, 23 has a form of a conventional perpendicular typeprobe stylus divided equally along its longitudinal axis. Thus, theassembly of the probe stylus of the fifth embodiment has a thicknesssubstantially equal to the conventional perpendicular type probe stylus.The first and second electrically conductive members 22, 23 areconnected to each other at their tip, where the probe stylus 21 contactswith a pad 5 disposed in a semiconductor device.

Referring to FIG. 17, probe card 31 comprises a first substrate 32, asecond substrate 33, a third substrate 34, a ring 35 and wiring 36. FIG.18 shows a detailed cross sectional view of the part J framed by abroken line in FIG. 17. As shown in FIG. 18, a first land 37, a secondland 38 are formed at the second substrate 33. And a fixing ring 39fixes the probe stylus 21 to the third substrate 34. The wiring 36 isfixed to the second substrate 33 by a soldering 40. The structure ofother elements is similar to that of the elements referred by the samereference numeral in FIGS. 15 and 17.

FIG. 19 shows a different connection of the probe card and the probestylus according to the fifth embodiment. FIG. 19 shows a detailed crosssectional view of the part J framed by a broken line in FIG. 17.Referring to FIG. 19, wiring 36 is fixed to the second substrate 33through a first and second single contactors 41, 42. A spring 43 isdisposed between the hole of the second substrate and each of the firstand second single contactors 41, 42. The structure of the other elementsis similar to that of elements referred by the same reference numeral inFIG. 18.

The function of the probe stylus according to the fifth embodiment isidentical to that of the first embodiment. And the advantage of theprobe stylus according to the fifth embodiment is similar to that ofthird embodiment.

SIXTH EMBODIMENT

In a probe stylus according to the fifth embodiment, the first andsecond electrically conductive members 22, 23 are connected at theirtip. On the other hand, in a probe stylus according to the sixthembodiment of the present invention, the first and second electricallyconductive members 22, 23 are not connected at their tip. And at aninspection of a semiconductor device, they are connected to each otherthrough a pad disposed in a semiconductor device. The other feature issimilar to that of the fifth embodiment.

FIG. 20 shows that the probe stylus 21 a is contacting with a pad 5disposed in a semiconductor device. Referring to the figure, referencenumerals 21 a, 22 a, 23 a denote a probe stylus, a first electricallyconductive member, and a second electrically conductive member,respectively. The first and second electrically conductive members 22 a,23 a are connected by an insulating member 24 a arranged between them.Reference numeral 5 denotes a pad disposed in a semiconductor.

The structure of a probe card having probe styluses 21 a according tothe sixth embodiment is similar to that of probe card shown in FIG. 17.The structure of the connecting part of a probe card and a probe stylus21 a according to the sixth embodiment is similar to that of shown inFIGS. 18, 19.

The function of the probe stylus according to the sixth embodiment issimilar to that of the second embodiment of the present invention.

And the advantage of the probe stylus according to the sixth embodimentis similar to that of fourth embodiment.

SEVENTH EMBODIMENT

FIG. 22 shows that the probe stylus 51 is contacting with a pad 5disposed in a semiconductor device. Referring to the figure, referencenumerals 51, 52, 53 denote a probe stylus, a first electricallyconductive member, and a second electrically conductive member,respectively. The first and second electrically conductive members 52,53 are connected by an insulating member 54 arranged between them.Reference numeral 5 denotes a pad disposed in a semiconductor.

The probe stylus 51 of the seventh embodiment of the present inventionis a so-called perpendicular type probe stylus. Each of the first andsecond electrically conductive members 52, 53 has a form of needle. Thecross section perpendicular to the longitudinal direction of the needleis half round. Namely, each of the first and second electricallyconductive member has a form of a conventional perpendicular type probestylus divided equally along its longitudinal axis. Thus, the assemblyof the probe stylus of the seventh embodiment has a diametersubstantially equal to the conventional probe stylus. The first andsecond electrically conductive members 52, 53 are connected to eachother at their tip, where the probe stylus 1 contacts with a pad 5disposed in the semiconductor device. A probe stylus according to theseventh embodiment of the present invention has a circular resilientportion at the tip portion of the first and second electricallyconductive members 52, 53, with which the probe stylus 1 contacts with apad 5 disposed in a semiconductor device.

The structure of a probe card having probe styluses 51 according to theseventh embodiment is similar to that of probe card shown in FIG. 17.The structure of the connecting part of a probe card and a probe stylus51 according to the seventh embodiment is similar to that of shown inFIGS. 18, 19.

The function of the probe stylus according to the seventh embodiment issimilar to that of the first embodiment of the present invention.

As explained, the probe stylus 51 according to the seventh embodiment ofthe present invention has a first electrically conductive member 52 anda second electrically conductive member 53. Therefore, the probe stylusfunctions equivalent to two probe styluses in the prior art. As aresult, by contacting one probe stylus to each pad disposed in asemiconductor device, it is possible to eliminate so-called dead band inthe comparator in a precise inspection of a semiconductor device at awafer state, or in an inspection of an I/O of a semiconductor device ata wafer state. Also in a case that a large number of pads are disposedin a semiconductor device, corresponding large number of probe stylusescan be disposed on a probe card, so that so-called dead band in thecomparator can be eliminated in a precise inspection of a semiconductordevice at a wafer state, or in an inspection of an I/O of asemiconductor device at a wafer state.

A probe stylus according to the seventh embodiment of the presentinvention functions equivalently to two probe stylus in the prior art,hence, the number of probe styluses 51 to be attached to a probe cardand/or the area required for the arrangement of the probe stylus in aprobe card can be reduced, as a result, the fabrication cost can bereduced.

Because the probe stylus 51 according to the seventh embodiment is aso-called perpendicular type probe stylus, a force urges the first andsecond electrically conductive members 52, 53 equally, when the probestylus 51 contacts with a pad 5 disposed in a semiconductor. As aresult, the structural reliability of the probe stylus 51 is improved.

In a probe stylus according to the seventh embodiment of the presentinvention, a circular resilient portion is formed at the tip portion ofthe first and second electrically conductive members 52,53, with whichthe probe stylus 51 contacts with a pad 5 disposed in the semiconductordevice. As a result, the impact at the contact of the probe stylus andthe pad disposed in the semiconductor is absorbed by the circularresilient portion. Therefore, a warp of a probe card, which may becaused by the contact of the probe styluses and the pads, can beavoided.

According to the seventh embodiment of the present invention, each ofthe first and second electrically conductive members 52, 53 has a roundcross section perpendicular to the longitudinal direction. And thediameter of each of the first and second electrically conductive membersis equal to that of a probe stylus in the prior art. Therefore, acurrent capacity of an electrically conductive member for forcing can beassured to be equal to that of probe stylus for forcing in the priorart, when any one of the first and second electrically conductivemembers 52, 53 is used as an electrically conductive member for forcingat a precise inspection of I/O of a semiconductor device.

EIGHTH EMBODIMENT

In a probe stylus according to the seventh embodiment, the first andsecond electrically conductive members 52, 53 are connected at theirtip. On the other hand, in a probe stylus according to the eighthembodiment of the present invention, the first and second electricallyconductive members are not connected at their tip. And at an inspectionof a semiconductor device, they are connected to each other through apad disposed in the semiconductor device. The other feature is similarto that of the first embodiment.

FIG. 24 shows that the probe stylus 51 a is contacting with a pad 5disposed in a semiconductor device. Referring to the figures, referencenumerals 51 a, 52 a, 53 a denote a probe stylus, a first electricallyconductive member, and a second electrically conductive member,respectively. The first and second electrically conductive members 52 a,53 a are connected by an insulating member 54 a arranged between them.Reference numeral 5 denotes a pad disposed in a semiconductor.

The structure of a probe card having probe stylus 51 a according to theeighth embodiment is similar to that of the probe card shown in FIG. 17.The connection between a probe stylus 51 a and the substrate of a probecard is similar to that shown in FIGS. 18, 19. The function of the probestylus and the probe card is similar to that of the second embodiment.

As explained, in the probe stylus according to the eighth embodiment,the first and second electrically conductive members 52 a, 53 a contactelectrically to each other through a pad 5 disposed in a semiconductorat an inspection of a semiconductor device. Therefore, the value ofvoltage and/or electric current can be compensated up to the pad 5, at aprecise inspection of a semiconductor device at a wafer state. And aline for driver and a line for comparator are assured up to the pad 5,at an inspection of an I/O of a semiconductor device at a wafer state.As a result, a higher precision inspection of a semiconductor devicebecomes possible. A probe stylus according to the eighth embodiment hassimilar advantages to that of a probe stylus according to the seventhembodiment.

NINTH EMBODIMENT

In a probe stylus according to the seventh embodiment, the cross sectionperpendicular to the longitudinal direction of the electricallyconductive members 52, 53 is round. On the other hand, the cross sectionperpendicular to the longitudinal direction of a first and secondelectrically conductive members of a probe stylus according to the ninthembodiment is half round. Namely, each of the first and secondelectrically conductive member has a form of an electrically conductivemember divided equally along its longitudinal axis. The other feature issimilar to that of the seventh embodiment.

FIG. 26 shows that the probe stylus 51 a is contacting with a pad 5disposed in a semiconductor device. Referring to the figure, referencenumerals 51 b, 52 b, 53 b denote a probe stylus, a first electricallyconductive member, and a second electrically conductive member,respectively. The first and second electrically conductive members 52 a,53 a are connected by an insulating member 54 b arranged between them.Reference numeral 5 denotes a pad disposed in a semiconductor.

The structure of a probe card having probe stylus 51 b according to theninth embodiment is similar to that of the probe card shown in FIG. 17.The connection between a probe stylus 51 b and the substrate of a probecard is similar to that shown in FIGS. 18, 19. The function of the probestylus and the probe card is similar to that of the first embodiment.

As explained, the probe stylus 51 b according to the ninth embodiment ofthe present invention has a first electrically conductive member 52 band a second electrically conductive member 53 b. Therefore, the probestylus 51 b functions equivalently to two probe styluses in the priorart. As a result, by contacting one probe stylus to each pad disposed inthe semiconductor device, it is possible to eliminate so-called deadband in the comparator in a precise inspection of a semiconductor deviceat a wafer state, or in an inspection of an I/O of a semiconductordevice at a wafer state. Hence, in a case that a large number of padsare disposed in a semiconductor device, corresponding large number ofprobe styluses 51 b can be disposed on a substrate of a probe card, sothat so-called dead band in the comparator can be eliminated in aprecise inspection of a semiconductor device at a wafer state, or in aninspection of an I/O of a semiconductor device at a wafer state.

Because the probe stylus 51 b according to the ninth embodimentfunctions equivalently to two probe styluses in the prior art, thenumber of probe styluses 51 b to be attached to a probe card and/or thearea required for the arrangement of the probe stylus 51 b in a probecard can be reduced. As a result, the fabrication cost can be reduced.

Additionally, according to the ninth embodiment of the presentinvention, each of the first and second electrically conductive members52 b, 53 b has a half round cross section perpendicular to thelongitudinal direction. Therefore, the thickness of the probe stylusaccording to the first embodiment is smaller than that of a bundle oftwo probe styluses of the prior art. As a result, also in a case that alarge number of pads are disposed in a semiconductor device, acorresponding number of the probe styluses 51 b can be attached onto aprobe card.

Because the probe stylus 51 b according to the ninth embodiment is aso-called perpendicular type probe stylus, a force urges the first andsecond electrically conductive members 52, 53 equally, when a probestylus 51 b contacts with a pad 5 disposed in a semiconductor As aresult, the structural reliability of the probe stylus 51 b is improved.

In a probe stylus according to the ninth embodiment of the presentinvention, a circular resilient portion is formed at the tip portion ofthe first and second electrically conductive members 52 b, 53 b, withwhich the probe stylus 51 b contacts with a pad 5 disposed in thesemiconductor device. As a result, the impact at the contact of theprobe stylus and the pad disposed in the semiconductor is absorbed bythe circular resilient portion. Therefore, a warp of a probe card, whichmay be caused by the contact of the probe styluses and the pads, can beavoided.

TENTH EMBODIMENT

In a probe stylus according to the ninth embodiment, the first andsecond electrically conductive members 52 b, 53 b are connected at theirtip. On the other hand, in a probe stylus according to the tenthembodiment of the present invention, the first and second electricallyconductive members are not connected at their tip. And at an inspectionof a semiconductor device, they are connected to each other through apad disposed in the semiconductor device. The other feature is similarto that of the ninth embodiment.

FIG. 28 shows that the probe stylus 51 a is contacting with a pad 5disposed in a semiconductor device. Referring to the figure, referencenumerals 51 c, 52 c, 53 c denote a probe stylus, a first electricallyconductive member, and a second electrically conductive member,respectively. The first and second electrically conductive members 52 c,53 c are connected by an insulating member 54 c arranged between them.Reference numeral 5 denotes a pad disposed in a semiconductor.

The structure of a probe card having probe stylus 51 c according to thetenth embodiment is similar to that of the probe card shown in FIG. 17.The connection between a probe stylus 51 c and the substrate of a probecard is similar to that shown in FIGS. 18, 19. The function of the probestylus and the probe card is similar to that of the second embodiment.

As explained, the first and second electrically conductive members 52 c,53 c in the probe stylus according to the tenth embodiment contactelectrically to each other through a pad 5 disposed in the semiconductorat an inspection of a semiconductor device. Therefore, the value ofvoltage and/or electric current can be compensated up to the pad 5, at aprecise inspection of a semiconductor device at a wafer state. And aline for driver and a line for comparator are assured up to the pad 5,at an inspection of an I/O of a semiconductor device at a wafer state.As a result, a higher precision inspection of a semiconductor devicebecomes possible.

A probe stylus according to the tenth embodiment has similar advantagesto that of a probe stylus according to the ninth embodiment.

ELEVENTH EMBODIMENT

FIG. 30 shows that the probe stylus 61 is contacting with a pad 5disposed in a semiconductor device. Referring to the figure, referencenumerals 61, 62, 63 denote a probe stylus, a first electricallyconductive member, and a second electrically conductive member,respectively. The first and second electrically conductive members 62,63 are connected by an insulating member 64 arranged between them.Reference numeral 5 denotes a pad disposed in a semiconductor.

The probe stylus 61 of the eleventh embodiment of the present inventionis a so-called perpendicular type probe stylus. Each of the first andsecond electrically conductive members 62, 63 has a form of needle. Thecross section perpendicular to the longitudinal direction of the needleis round. Namely, each of the first and second electrically conductivemember 62, 63 has a form of a conventional perpendicular type probestylus.

A probe stylus according to the eleventh embodiment of the presentinvention has a Y-formed resilient portion at the tip portion of thefirst and second electrically conductive members 62,63, with which theprobe stylus 61 contacts with a pad 5 disposed in a semiconductordevice. The first and second electrically conductive members 6 areconnected to each other through a third electrically conductive member65, which is disposed between the tip of the electrically conductivemembers, where the probe stylus contacts with a pad disposed in asemiconductor device.

The structure of a probe card having probe stylus 61 according to theeleventh embodiment is similar to that of the probe card shown in FIG.17. The connection between a probe stylus 61 and the substrate of aprobe card is similar to that shown in FIGS. 18, 19. The function of theprobe stylus and the probe card is similar to that of the secondembodiment.

As explained, according to the eleventh embodiment, the tip portion of aprobe stylus 61, where the probe stylus contacts with a pad disposed ina semiconductor device, is widened, therefore a probe stylus 61 contactswith a pad 5 at two points. As a result, the electric resistance at thecontact between the probe stylus and the pad is small. A probe stylusaccording to the eleventh embodiment has advantages similar to that ofthe seventh embodiment.

TWELFTH EMBODIMENT

In a probe stylus according to the eleventh embodiment, the first andsecond electrically conductive members 62, 63 are connected through athird electrically conductive member 65 disposed at their tip. On theother hand, in a probe stylus according to the twelfth embodiment of thepresent invention, no such a third electrically conductive member forconnecting the first and second electrically conductive members 62, 63are disposed. And at an inspection of a semiconductor device, they areconnected to each other through a pad disposed in the semiconductordevice. The other feature is similar to that, of the eleventhembodiment.

FIG. 32 shows that the probe stylus 61 a is contacting with a pad 5disposed in a semiconductor device. Referring to the figure, referencenumerals 61 a, 62 a, 63 a denote a probe stylus, a first electricallyconductive member, and a second electrically conductive member,respectively. The first and second electrically conductive members 62 a,63 a are connected by an insulating member 64 a arranged between them.Reference numeral 5 denotes a pad disposed in a semiconductor.

The structure of a probe card having probe stylus 61 a according to thetwelfth embodiment is similar to that of the probe card shown in FIG.17. The connection between a probe stylus 61 a and the substrate of aprobe card is similar to that shown in FIGS. 18, 19. The function of theprobe stylus and the probe card is similar to that of the secondembodiment.

As explained, according to the twelfth embodiment, the tip portion of aprobe stylus 61 a, where the probe stylus contacts with the pad disposedin a semiconductor device, is widened, therefore a probe stylus 61contacts with a pad 5 at two points. As a result, the electricresistance at the contact between the probe stylus and the pad is small.A probe stylus according to the twelfth embodiment has advantagessimilar to that of the eighth embodiment.

THIRTEENTH EMBODIMENT

In a probe stylus according to the eleventh embodiment, the crosssection perpendicular to the longitudinal direction of the electricallyconductive members 52, 53 is round. On the other hand, the cross sectionperpendicular to the longitudinal direction of a first and secondelectrically conductive members of a probe stylus according to thethirteenth embodiment is half round. Namely, each of the first andsecond electrically conductive member has a form of a first and secondelectrically conductive members in the eleventh embodiment dividedequally along its longitudinal axis. The other feature is similar tothat of the seventh embodiment.

FIG. 34 shows that the probe stylus 61 b is contacting with a pad 5disposed in a semiconductor device. Referring to the figure, referencenumerals 61 b, 62 b, 63 b denote a probe stylus, a first electricallyconductive member, and a second electrically conductive member,respectively. The first and second electrically conductive members 62 a,63 a are connected by an insulating member 64 b arranged between them.The firsts and second electrically conductive members 62 b, 63 b areelectrically connected by a third electrically conductive member 65 b.Reference numeral 5 denotes a pad disposed in a semiconductor.

The structure of a probe card having probe stylus 61 b according to thethirteenth embodiment is similar to that of the probe card shown in FIG.17. The connection between a probe stylus 61 b and the substrate of aprobe card is similar to that shown in FIGS. 18, 19. The function of theprobe stylus and the probe card is similar to that of the firstembodiment.

A probe stylus according to the thirteenth embodiment has advantagessimilar to that of the ninth embodiment.

FOURTEENTH EMBODIMENT

In a probe stylus according to the thirteenth embodiment, the first andsecond electrically conductive members 62 b, 63 b are connected througha third electrically conductive member 65 b disposed near to their tip.On the other hand, in a probe stylus according to the fourteenthembodiment of the present invention, no such a third electricallyconductive member for connecting the first and second electricallyconductive members are disposed. And at an inspection of a semiconductordevice, they are connected to each other through a pad disposed in asemiconductor device. The other feature is similar to that of thethirteenth embodiment.

FIG. 36 shows that the probe stylus is contacting with a pad disposed ina semiconductor device. Referring to the figure, reference numerals 61c, 62 c, 63 c denote a probe stylus, a first electrically conductivemember, and a second electrically conductive member, respectively. Thefirst and second electrically conductive members 62 a, 63 a areconnected by an insulating member 64 c arranged between them. Referencenumeral 5 denotes a pad disposed in a semiconductor.

The structure of a probe card having probe stylus 61 c according to thefourteenth embodiment is similar to that of the probe card shown in FIG.17. The connection between a probe stylus 61 c and the substrate of aprobe card is similar to that shown in FIGS. 18, 19. The function of theprobe stylus and the probe card is similar to that of the secondembodiment.

A probe stylus according to the fourteenth embodiment has advantagessimilar to that of the tenth embodiment.

FIFTEENTH EMBODIMENT

FIG. 38 shows that the probe stylus is contacting with a pad disposed ina semiconductor device. Referring to the figure, reference numerals 71,72, 73 denote a probe stylus, a first electrically conductive member,and a second electrically conductive member, respectively. The first andsecond electrically conductive members 72, 73 are connected by aninsulating member 74 arranged between them. Reference numeral 5 denotesa pad disposed in a semiconductor.

The probe stylus 71 of the fifteen embodiment of the present inventionis a so-called perpendicular type probe stylus. Each of the first andsecond electrically conductive members 72, 73 has a form of needle. Thecross section perpendicular to the longitudinal direction of the needleis round. In this embodiment, the diameter of the second electricallyconductive member 72 is smaller than that of the first electricallyconductive member 73. Namely, the assembly of the probe stylus of thefifteenth embodiment has a thickness substantially equal to theconventional probe stylus. A probe stylus according to the fifteenthembodiment of the present invention has an arc or jack-knifed resilientportion at the tip portion of the first and second electricallyconductive members 72,73, with which the probe stylus contacts with apad 5 disposed in a semiconductor device. The first and secondelectrically conductive members 72, 73 are connected to each other attheir tip portion, where the probe stylus contacts with a pad 5 disposedin the semiconductor device.

The structure of a probe card having probe styluses 71 according to thefifteenth embodiment is similar to that of probe card shown in FIG.17.The structure of the connecting part of a probe card and a probestylus 71 according to the seventh embodiment is similar to that ofshown in FIGS. 18, 19. The function of the probe stylus according to thefifteenth embodiment is similar to that of the first embodiment of thepresent invention.

As explained, the probe stylus 71 according to the fifteenth embodimentof the present invention has a first electrically conductive member 72and a second electrically conductive member 73. Therefore, the probestylus functions equivalent to two probe styluses in the prior art. As aresult, by contacting one probe stylus to each pad disposed in thesemiconductor device, it is possible to eliminate so-called dead band inthe comparator in a precise inspection of a semiconductor device at awafer state, or in an inspection of an I/O of a semiconductor device ata wafer state. Also in a case that a large number of pads are disposedin a semiconductor device, corresponding large number of probe stylusescan be disposed on a probe card, so that so-called dead band in thecomparator can be eliminated in a precise inspection of a semiconductordevice at a wafer state, or in an inspection of an I/O of asemiconductor device at a wafer state.

A probe stylus according to the fifteenth embodiment of the presentinvention functions equivalently to two probe stylus in the prior art,hence, the number of probe styluses 71 to be attached to a probe cardand/or the area required for the arrangement of the probe stylus in aprobe card can be reduced, as a result, the fabrication cost can bereduced.

According to the fifteenth embodiment of the present invention, thediameter of the second electrically conductive member 73 is smaller thanthat of the first electrically conductive member 72. And the diameter ofthe probe stylus 71 is substantially equal to that of a probe stylus ofthe prior art. Therefore, the thickness of the probe stylus 71 accordingto the fifteenth embodiment is smaller than that of bundled two probestyluses in the prior art. As a result, also in a case that a largenumber of pads are disposed in a semiconductor device, a correspondingnumber of the probe styluses 1 can be attached onto a probe card.

In a probe stylus according to the fifteenth embodiment of the presentinvention, an arc or jack-knifed resilient portion is formed at the tipportion of the first and second electrically conductive members 72,73,with which the probe stylus 71 contacts with a pad 5 disposed in thesemiconductor device. As a result, the impact at the contact of theprobe stylus and the pad disposed in the semiconductor is absorbed bythe resilient portion. Therefore, a warp of a probe card, which may becaused by the contact of the probe styluses and the pads, can beavoided.

According to the fifteenth embodiment, the first electrically conductivemember 72 has a round cross section perpendicular to the longitudinaldirection. And the diameter of the first electrically conductive membersis substantially equal to that of a probe stylus in the prior art.Therefore, a current capacity of an electrically conductive member forforcing at a precise inspection of I/O of a semiconductor device at awafer state can be assured to be equal to that of probe stylus forforcing in the prior art.

SIXTEENTH EMBODIMENT

In a probe stylus according to the fifteenth embodiment, the first andsecond electrically conductive members 72, 73 are connected to eachother. On the other hand, in a probe stylus according to the sixteenthembodiment of the present invention, the first and second electricallyconductive member are not connected to each other. And at an inspectionof a semiconductor device, they are connected to each other through apad disposed in a semiconductor device. The other feature is similar tothat of the fifteenth embodiment.

FIG.40 shows that the probe stylus is contacting with a pad disposed ina semiconductor device. Referring to the figure, reference numerals 71c, 72 c, 73 c denote a probe stylus, a first electrically conductivemember, and a second electrically conductive member, respectively. Thefirst and second electrically conductive member 72 a, 73 a are connectedby an insulating member 74 a arranged between them. Reference numeral 5denotes a pad disposed in a semiconductor.

The structure of a probe card having probe stylus 71 c according to thesixteenth embodiment is similar to that of the probe card shown in FIG.17. The connection between a probe stylus 71 c and the substrate of aprobe card is similar to that shown in FIGS. 18, 19. The function of theprobe stylus and the probe card is similar to that of the secondembodiment.

As explained, the first and second electrically conductive members 72 a,73 a in the probe stylus according to the sixteenth embodiment contactelectrically to each other through a pad 5 disposed in a semiconductorat an inspection of a semiconductor device. Therefore, the value ofvoltage and/or electric current can be compensated up to the pad 5, at aprecise inspection of a semiconductor device at a wafer state. And aline for driver and a line for comparator are assured up to the pad 5,at an inspection of an I/O of a semiconductor device at a wafer state.As a result, a higher precision inspection of a semiconductor devicebecomes possible.

A probe stylus according to the sixteenth embodiment has advantagessimilar to that of the fifteenth embodiment.

SEVENTEENTH EMBODIMENT

FIG. 42 shows that the probe stylus is contacting with a pad disposed ina semiconductor device. Referring to the figure, reference numerals 81,82, 83 denote a probe stylus, a first electrically conductive member,and a second electrically conductive member, respectively. The first andsecond electrically conductive members 82, 83 are connected by aninsulating member 84 arranged between them. Reference numeral 5 denotesa pad disposed in a semiconductor.

The probe stylus 81 of the seventeenth embodiment of the presentinvention is a so-called cantilever type probe stylus. The firstelectrically conductive members 82 has a form of needle. The crosssection perpendicular to the longitudinal direction of the needle isround. The second electrically conductive member 83 has a form ofcylinder covering the first electrically conductive member 82. In thisembodiment, the first electrically conductive member 82 has a thicknessequal to that of a cantilever type probe stylus in the prior art, andthe outer side of the first electrically conductive member is coveredwith an insulating member 84. Further, the outside of the insulatingmember 84 is covered with the second electrically conductive member 83.Thus, the assembly of the probe stylus of the seventeenth embodiment hasa thickness substantially equal to a cantilever type probe stylus in theprior art. The first and second electrically conductive members 82, 83are connected to each other at their tip, where the probe styluscontacts with a pad disposed in a semiconductor device.

The structure of a probe card having probe stylus 81 according to theseventeenth embodiment is similar to that of the probe card shown inFIG. 4. FIG. 44 is a detailed cross sectional view of the connectingportion between the probe card and a probe stylus according to theseventeenth embodiment. FIG. 44 corresponds to FIG. 5. Each element inFIG. 44 corresponding to an element in FIG. 5 and/or 42 is referred bythe same reference numeral. The function of the probe stylus and theprobe card is similar to that of the first embodiment.

As explained, the probe stylus 81 according to the seventeenthembodiment of the present invention has a first electrically conductivemember 82 and a second electrically conductive member 83. Therefore,such a probe stylus functions equivalent to two probe styluses in theprior art. As a result, by contacting one probe stylus to each paddisposed in the semiconductor device, it is possible to eliminateso-called dead band in the comparator in a precise inspection of asemiconductor device at a wafer state, or in an inspection of an I/O ofa semiconductor device at a wafer state. Also in a case that a largenumber of pads are disposed in a semiconductor device, correspondinglarge number of probe styluses can be disposed on a probe card, so thatso-called dead band in the comparator can be eliminated in a preciseinspection of a semiconductor device at a wafer state, or in aninspection of an I/O of a semiconductor device at a wafer state.

A probe stylus according to the seventeenth embodiment of the presentinvention functions equivalently to two probe stylus in the prior art,hence, the number of probe styluses 81 to be attached to a probe cardand/or the area required for the arrangement of the probe stylus in aprobe card can be reduced, as a result, the fabrication cost can bereduced.

In this embodiment, the assembly of the probe stylus of the seventeenthembodiment has a thickness substantially equal to a cantilever typeprobe stylus in the prior art. Therefore, the thickness of the probestylus 81 according to the seventeenth embodiment is smaller than thatof bundled two probe styluses in the prior art. As a result, also in acase that a large number of pads are disposed in a semiconductor device,a corresponding number of the probe styluses 81 can be attached onto aprobe card.

According to the seventeenth embodiment of the present invention, thefirst electrically conductive members 82 has a round cross sectionperpendicular to the longitudinal direction. And the diameter of thefirst electrically conductive members is substantially equal to that ofa probe stylus in the prior art. Therefore, a current capacity of anelectrically conductive member for forcing can be assured to be equal tothat of probe stylus for forcing in the prior art, when the firstelectrically conductive members 82 is used as an electrically conductivemember for forcing at a precise inspection of I/O of a semiconductordevice at a wafer state.

According to the seventeenth embodiment, the first electricallyconductive member 82 is covered with an insulating member 84, and theinsulating member 84, in turn, is covered with the second electricallyconductive member 83. Therefore, when the first electrically conductivemember 82 is used for sensing, the electrically conductive member forsensing can be protected from external noises.

EIGHTEENTH EMBODIMENT

In a probe stylus according to the seventeenth embodiment, the first andsecond electrically conductive members 82, 83 are connected at theirtip. On the other hand, in a probe stylus according to the eighteenthembodiment of the present invention, the first and second electricallyconductive members are not connected at their tip. And at an inspectionof a semiconductor device, they are connected to each other through apad disposed in the semiconductor device. The other feature is similarto that of the seventeenth embodiment.

FIG. 45 shows that the probe stylus is contacting with a pad disposed ina semiconductor device. Referring to the figure, reference numerals 81a, 82 a, 83 a denote a probe stylus, a first electrically conductivemember, and a second electrically conductive member, respectively. Thefirst and second electrically conductive members 82 a, 83 a areconnected by an insulating member 84 a arranged between them. Referencenumeral 5 denotes a pad disposed in a semiconductor.

The structure of a probe card having probe stylus 81 a according to theeighteenth embodiment is similar to that of the probe card shown in FIG.4. The connection between a probe stylus 81 a and the substrate of aprobe card is similar to that shown in FIG. 44 The function of the probecard and the probe stylus is similar to that of the second embodiment.

As explained, the first and second electrically conductive members 82 a,83 a in the probe stylus according to the eighteenth embodiment contactelectrically to each other through a pad 5 disposed in the semiconductorat an inspection of a semiconductor device. Therefore, the value ofvoltage and/or electric current can be compensated up to the pad 5, at aprecise inspection of a semiconductor device at a wafer state. And aline for driver and a line for comparator are assured up to the pad 5;at an inspection of an I/O of a semiconductor device at a wafer state.As a result, a higher precision inspection of a semiconductor devicebecomes possible.

A probe stylus according to the eighteenth embodiment has advantagessimilar to that of the seventeenth embodiment.

NINETEENTH EMBODIMENT

FIG. 47 shows that the probe stylus is contacting with a pad disposed ina semiconductor device. Referring to the figure, reference numerals 91,92, 93 denote a probe stylus, a first electrically conductive member,and a second electrically conductive member, respectively. The first andsecond electrically conductive members 92, 93 are connected by aninsulating member 94 arranged between them. Reference numeral 5 denotesa pad disposed in a semiconductor.

The probe stylus 91 of the nineteenth embodiment of the presentinvention is a so-called perpendicular type probe stylus. The firstelectrically conductive members 92 has a form of needle and its crosssection perpendicular to the longitudinal direction of the needle isround. The second electrically conductive member 93 has a form of acylinder, and covers the first electrically conductive member 92. Inthis embodiment, the first electrically conductive member 92 has athickness substantially equal to that of a perpendicular type probestylus in the prior art, and the outer side of the first electricallyconductive member is covered with an insulating member 94. Further, theoutside of the insulating member 94 is covered with the secondelectrically conductive member 93. Thus, the assembly of the probestylus of the nineteenth embodiment has a thickness substantially equalto a perpendicular type probe stylus in the prior art. The first andsecond electrically conductive members 92, 93 are connected to eachother at their tip portion, where the probe stylus contacts with a pad 5disposed in a semiconductor device.

The structure of a probe card having probe stylus 91 according to thenineteenth embodiment is similar to that of the probe card shown in FIG.17.

FIG. 49 is a detailed cross sectional view of an example of theconnecting portion between the probe card and a substrate of a probestylus 91 according to the nineteenth embodiment. FIG. 49 corresponds toFIG. 18. In the figure, reference numeral 96 denotes a electricallyconductive boss. And reference numeral 97 denotes a spring. The otherelement corresponding to an element in FIG. 47 is referred by the samereference numeral.

FIG. 50 is a detailed cross sectional view of another example of theconnecting portion between the probe card and a substrate of a probestylus 91 according to the nineteenth embodiment. FIG. 50 corresponds toFIG. 19. In the figure, reference numerals 98, 99, and 100 denote acontacter, a electrically conductive bar and an insulating member,respectively. The other element corresponding to an element in FIG. 49is referred by the same reference numeral. The function of the probestylus and the probe card is similar to that of the first embodiment.The probe stylus according to the nineteenth embodiment has advantagessimilar to that of the seventeenth embodiment.

TWENTIETH EMBODIMENT

In a probe stylus according to the nineteenth embodiment, the first andsecond electrically conductive members 92, 93 are connected at theirtip. On the other hand, in a probe stylus according to the twentiethembodiment of the present invention, the first and second electricallyconductive members are not connected at their tip. And at an inspectionof a semiconductor device, they are connected to each other through apad disposed in the semiconductor device. The other feature is similarto that of the nineteenth embodiment.

FIG. 51 shows that the probe stylus is contacting with a pad disposed ina semiconductor device. Referring to the figure, reference numerals 91a, 92 a, 93 a denote a probe stylus, a first electrically conductivemember, and a second electrically conductive member, respectively. Thefirst and second electrically conductive members 92 a, 93 a areconnected by an insulating member 94 a arranged between them. Referencenumeral 5 denotes a pad disposed in a semiconductor.

The structure of a probe card having probe stylus 91 a according to thetwentieth embodiment is similar to that of the probe card shown in FIG.17. The connection between a probe stylus 91 a and the substrate of aprobe card is similar to that shown in FIG. 49 and 50. The function ofthe probe card and the probe stylus is similar to that of the secondembodiment. The probe stylus according to the twentieth embodiment hasadvantages similar to that of the eighteenth embodiment.

TWENTY-FIRST EMBODIMENT

FIG. 53 shows that the probe stylus is contacting with a pad disposed ina semiconductor device. Referring to the figure, reference numerals 101,102, 103 denote a probe stylus, a first electrically conductive member,and a second electrically conductive member, respectively. The first andsecond electrically conductive members 102, 103 are connected by aninsulating member 104 arranged between them. Reference numeral 5 denotesa pad disposed in a semiconductor.

The probe stylus 101 of the twenty-first embodiment of the presentinvention is a so-called perpendicular type probe stylus. The firstelectrically conductive members 102 has a form of needle and its crosssection perpendicular to the longitudinal direction of the needle isround. The second electrically conductive member 103 has a form ofcylinder, and covers the first electrically conductive member 102. Inthis embodiment, the first electrically conductive member 102 has athickness equal to that of a perpendicular type probe stylus in theprior art, and the outer side of the first electrically conductivemember is covered with an insulating member 104. Further, the outside ofthe insulating member 104 is covered with the second electricallyconductive member 103. Thus, the assembly of the probe stylus of thetwenty-first embodiment has a thickness substantially equal to aperpendicular type probe stylus in the prior art.

A probe stylus 101 according to the twenty-first embodiment of thepresent invention has an arc or jack-knifed resilient portion at the tipportion of the first and second electrically conductive members 102,103, with which the probe stylus 101 contacts with a pad 5 disposed inthe semiconductor device. The first and second electrically conductivemembers 102, 103 are connected to each other at their tip, where theprobe stylus 101 contacts with a pad 5 disposed in the semiconductordevice.

The structure of a probe card having probe stylus 101 according to thetwenty-first embodiment is similar to that of the probe card shown inFIG. 17. The connection between a probe stylus 101 and the substrate ofa probe card is similar to that shown in FIG. 49 and 50. The function ofthe probe card and the probe stylus is similar to that of the firstembodiment.

In a probe stylus according to the twenty-first embodiment of thepresent invention, an arc or jack-knifed resilient portion is formed atthe tip portion of the first and second electrically conductive members102, 103, with which the probe stylus contacts with a pad 5, which isdisposed in a semiconductor device. As a result, the impact at thecontact of the probe stylus and the pad disposed in the semiconductor isabsorbed by the resilient portion. Therefore, a warp of a probe card,which may be caused by the contact of the probe styluses and the pads,can be avoided. The probe stylus according to the twenty-firstembodiment has advantages similar to that of the seventeenth embodiment.

TWENTY-SECOND EMBODIMENT

In a probe stylus according to the twenty-first embodiment, the firstand second electrically conductive members, 102, 103 are connected attheir tip. On the other hand, in a probe stylus according to thetwenty-second embodiment of the present invention, the first and secondelectrically conductive members are not connected at their tip. And atan inspection of a semiconductor device, they are connected to eachother through a pad disposed in a semiconductor device. The otherfeature is similar to that of the twenty-first embodiment.

FIG. 55 shows that the probe stylus is contacting with a pad disposed ina semiconductor device. Referring to the figure, reference numerals 101a, 102 a, 103 a denote a probe stylus, a first electrically conductivemember, and a second electrically conductive member, respectively. Thefirst and second electrically conductive members 102 a, 103 a areconnected by an insulating member 104 a arranged between them. Referencenumeral 5 denotes a pad disposed in a semiconductor.

The structure of a probe card having probe stylus 101 a according to thetwenty-second embodiment is similar to that of the probe card shown inFIG. 17. The connection between a probe stylus 101 a and the substrateof a probe card is similar to that shown in FIG. 49, 50. The function ofthe probe card and the probe stylus is similar to that of the secondembodiment.

In a probe stylus according to the twenty-second embodiment of thepresent invention, an arc or jack-knifed resilient portion is formed atthe tip portion of the first and second electrically conductive members102 a, 103 a, with which the probe stylus contacts with a pad 5, whichis disposed in a semiconductor device. As a result, the impact at thecontact of the probe stylus and the pad disposed in the semiconductor isabsorbed by the resilient portion. Therefore, a warp of a probe card,which may be caused by the contact of the probe styluses 101 a and thepads, can be avoided. The probe stylus according to the twenty-secondembodiment has advantages similar to that of the eighteenth embodiment.

TWENTY-THIRD EMBODIMENT

FIG. 57, 58 are schematic plan views of a probe stylus according to thetwenty-third embodiment. FIG. 57 shows a state that the probe stylus isnot contacting with a pad disposed in a semiconductor. And FIG. 58 showsa state that the probe stylus is contacting with a pad disposed in asemiconductor. FIG. 59 is a side view of a probe stylus seen from theside B1 in FIG. 57. FIG. 60 is a cross sectional view of an example of aprobe stylus. FIG. 60(a) shows a cross section along the line C1—C1 inFIG. 57. FIG. 60(b) shows a cross section along the line D1—D1 in FIG.57. FIG. 61 is a cross sectional view of another example of a probestylus, which has a form different from that of FIG. 60. FIG. 61(a)shows a cross section along the line C1—C1 in FIG. 57. FIG. 61(b) showsa cross section along the line D1—D1 in FIG. 57.

Referring to the figures, reference numerals 111, 112, 113 denote aprobe stylus, a first electrically conductive member, and a secondelectrically conductive member, respectively. The first and secondelectrically conductive members 112, 113 are connected by an insulatingmember 114 arranged between them. Reference numeral 5 denotes a paddisposed in a semiconductor.

A probe stylus according to the twenty third embodiment of the presentinvention is a so-called cantilever type probe stylus. The first andsecond electrically conductive members 112, 113 have a form of needle.Their cross section perpendicular to their longitudinal direction are anarc as shown in FIGS. 60(a), (b) or a quadrate as shown in FIGS. 61(a),(b). The nearer to their tip, where the probe stylus contacts with a pad5 disposed in a semiconductor device, the thinner their thickness is.According to the twenty-third embodiment, a slit is disposed in the tipportion of the probe stylus, where the probe stylus contacts with a paddisposed in a semiconductor stylus. When the probe stylus does notcontact with a pad 5, the slit closes so that the first and secondelectrically conductive members 112, 113 contact to each other. On theother hand, when the probe stylus contacts with a pad 5, the slit opensso that the first and second electrically conductive members 112, 113separate from each other.

The structure of a probe card having probe stylus 111 according to thetwenty-third embodiment is similar to that of the probe card shown inFIG. 4. The connection between a probe stylus 111 and the substrate of aprobe card is similar to that shown in FIG. 12. The function of theprobe card and the probe stylus is similar to that of the secondembodiment.

As explained, the probe stylus 1 according to the twenty-thirdembodiment of the present invention has a first electrically conductivemember 112 and a second electrically conductive member 113. Therefore,such a probe stylus functions equivalent to two probe styluses in theprior art. As a result, by contacting one probe stylus to each paddisposed in the semiconductor device, it is possible to eliminateso-called dead band in the comparator in a precise inspection of asemiconductor device at a wafer state, or in an inspection of an I/O ofa semiconductor device at a wafer state. Also in a case that a largenumber of pads are disposed in a semiconductor device, correspondinglarge number of probe styluses can be disposed on a probe card, so thatso-called dead band in the comparator can be eliminated in a preciseinspection of a semiconductor device at a wafer state, or in aninspection of an I/O of a semiconductor device at a wafer state.

A probe stylus according to the twenty-third embodiment of the presentinvention functions equivalently to two probe stylus in the prior art,hence, the number of probe styluses 111 to be attached to a probe cardand/or the area required for the arrangement of the probe stylus in aprobe card can be reduced, as a result, the fabrication cost can bereduced.

Because the first and second electrically conductive members 112, 113 ofthe probe stylus according to the twenty-third embodiment are arrangedside by side, a force urges them equally, when the probe stylus 111contacts with a pad 5 disposed in a semiconductor. As a result, thestructural reliability of the probe stylus is improved.

In a probe stylus according to the twenty-third embodiment of thepresent invention, a slit is disposed between the tip portion of thefirst and second electrically conductive members 112,113, with which theprobe stylus 111 contacts with a pad 5 disposed in the semiconductordevice. As a result, the impact at the contact of the probe stylus 111and the pad 5 disposed in the semiconductor is absorbed by the slitportion. Therefore, a warp of a probe card, which may be caused by thecontact of the probe styluses and the pads, can be avoided.

The first and second electrically conductive members 112, 113 in theprobe stylus 111 according to the twenty-third embodiment separate fromeach other, when the probe stylus 111 contacts with a pad 5 disposed ina semiconductor. Therefore, the value of voltage and/or electric currentcan be compensated up to the pad 5, at a precise inspection of asemiconductor device at a wafer state. And a line for driver and a linefor comparator are assured up to the pad 5, at an inspection of an I/Oof a semiconductor device at a wafer state. As a result, a higherprecision inspection of a semiconductor device becomes possible.

What is claimed is:
 1. A probe stylus for inspecting a semiconductordevice, which contacts a pad disposed in a semiconductor device duringan inspection of the semiconductor device, wherein the probe styluscomprises: a first electrically conductive member formed as a needle, asecond electrically conductive member formed as a needle, and aninsulating member arranged between the first electrically conductivemember and the second electrically conductive member and connecting themso that the first and second electrically conductive members and theinsulating member form a single needle, wherein the first electricallyconductive member is covered with the insulating member, and theinsulating member is covered with the second electrically conductivemember, and the first and second electrically conductive members areelectrically connected to each other at their tip portion.
 2. A probestylus for inspecting a semiconductor device, which contacts a paddisposed in a semiconductor device during an inspection of thesemiconductor device, wherein the probe stylus comprises: a firstelectrically conductive member formed as a needle, a second electricallyconductive member formed as a needle, and an insulating member arrangedbetween the first electrically conductive member and the secondelectrically conductive member and connecting them so that the first andsecond electrically conductive members and the insulating member form asingle needle, wherein the first electrically conductive member iscovered with the insulating member, and the insulating member is coveredwith the second electrically conductive member, and the first and secondelectrically conductive members are not electrically connected to eachother at their tip portion, but are connected to each other through apad disposed in a semiconductor device at an inspection of thesemiconductor device.